A new MEMS wafer probe card

Author

Zhang, Ye ; Zhang, Ye ; Worsham, D. ; Morrow, D. ; Marcus, R.B.

Author_Institution

Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA

fYear

1997

fDate

26-30 Jan 1997

Firstpage

395

Lastpage

399

Abstract

This work presents a new type of wafer probe card consisting of an array of microcantilevers actuated by bimorph heating to make contact with the contact pads on a device chip during wafer-stage testing. The microcantilevers are meant to be operated either in air or in vacuum. Bending action is created through Joule heating of a bimorph film element on the cantilever. The deflection efficiency dδ/dP ranges from 5.8 to 9.6 μm/mW (depending on lever parameters), the force efficiency dF/dP ranges from 1.4 to 5.5 μN/mW; maximum controllable (reversible) deflection is in the range of 150 μm, and contact resistance to a gold pad is approximately 1 Ω

Keywords

bending; integrated circuit testing; microactuators; microsensors; 1 ohm; 150 mum; Au; Joule heating; MEMS wafer probe card; Si; air; array of microcantilevers; bending; bimorph film element; bimorph heating; contact pads; contact resistance; controllable deflection; deflection efficiency; device chip; gold pad; vacuum; wafer-stage testing; Biomembranes; Contact resistance; Force control; Gold; Heating; Micromechanical devices; Physics; Probes; Prototypes; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on

Conference_Location

Nagoya

ISSN

1084-6999

Print_ISBN

0-7803-3744-1

Type

conf

DOI

10.1109/MEMSYS.1997.581868

Filename

581868