DocumentCode :
3428811
Title :
Comparative study of various release methods for polysilicon surface micromachining
Author :
Kim, Chang-Jin ; Chang-Jin Kim
Author_Institution :
Dept. of Mech. & Aerosp. Eng., California Univ., Los Angeles, CA, USA
fYear :
1997
fDate :
26-30 Jan 1997
Firstpage :
442
Lastpage :
447
Abstract :
This paper presents an objective comparison of various release techniques for polysilicon surface micromachining using identical test structures made by MCNC Multi-User MEMS Processes (MUMPs). Test structures of varying width and length were prepared using five different releasing procedures-evaporation drying with deionized water and methanol as final rinsing liquids, sublimation drying using p-dichlorobenzene and t-butyl alcohol, and CO2 supercritical drying. Both sublimation drying methods as well as supercritical drying rendered good results with 2 μm thick, 2 μm gap polysilicon cantilevers up to 700 μm in length. In addition, the systematic test in this study reveals, for the first time, that the maximum beam length obtainable increases as the beam width increases for the case of sublimation, opposite to the well known case of evaporation drying. In the course, we also introduce a new setup that considerably improves the way sublimation is used for releasing
Keywords :
drying; elemental semiconductors; evaporation; micromachining; micromechanical devices; semiconductor device testing; silicon; 2 micron; 700 micron; CO2; MCNC multi-user MEMS processes; Si; evaporation drying; maximum beam length; polysilicon cantilevers; release methods; sublimation drying; supercritical drying; surface micromachining; test structures; Aerospace engineering; Aerospace testing; Liquids; Methanol; Micromachining; Micromechanical devices; Microstructure; Rough surfaces; Surface roughness; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
ISSN :
1084-6999
Print_ISBN :
0-7803-3744-1
Type :
conf
DOI :
10.1109/MEMSYS.1997.581886
Filename :
581886
Link To Document :
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