DocumentCode
3428881
Title
Angular micropositioner for disk drives
Author
Horsley, David A. ; Singh, Angad ; Pisano, Albert P. ; Horowitz, Roberto
Author_Institution
Sensor & Actuator Center, California Univ., Berkeley, CA, USA
fYear
1997
fDate
26-30 Jan 1997
Firstpage
454
Lastpage
459
Abstract
Rotary electrostatic microactuators suitable for use in a two-stage servo system for magnetic disk drives have been fabricated using the HexSil process. A 2.6 mm diameter device is shown to be capable of producing 0.17 mN-mm of output torque, corresponding to a predicted actuation bandwidth of 1.6 kHz. The structures are formed from LPCVD polysilicon deposited into deep trenches etched into a silicon mold wafer. Upon release, these structures are transferred to a target wafer using a solder bond. The solder bonding process will provide easy integration of mechanical structures with integrated circuits, allowing separate optimization of the circuit and structure fabrication processes. An advantage of HexSil is that once the mold wafer has undergone the initial plasma etching, it may be re-used for subsequent polysilicon depositions, amortizing the cost of the deep trench etching over many structural runs and thereby significantly reducing the cost of finished actuators. Further, 100 μm high structures may be made from a 3 μm deposition of polysilicon, increasing overall fabrication speed
Keywords
chemical vapour deposition; electrostatic devices; elemental semiconductors; hard discs; microactuators; semiconductor growth; silicon; sputter etching; wafer bonding; 1.6 kHz; 100 micron; 2.6 mm; HexSil process; LPCVD; Si; actuation bandwidth; angular micropositioner; deep trenches; disk drives; fabrication speed; mechanical structures; mold wafer; output torque; plasma etching; polysilicon; rotary electrostatic microactuators; solder bonding process; two-stage servo system; Bandwidth; Costs; Disk drives; Electrostatics; Etching; Fabrication; Magnetic separation; Microactuators; Servomechanisms; Torque;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location
Nagoya
ISSN
1084-6999
Print_ISBN
0-7803-3744-1
Type
conf
DOI
10.1109/MEMSYS.1997.581890
Filename
581890
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