DocumentCode :
3428881
Title :
Angular micropositioner for disk drives
Author :
Horsley, David A. ; Singh, Angad ; Pisano, Albert P. ; Horowitz, Roberto
Author_Institution :
Sensor & Actuator Center, California Univ., Berkeley, CA, USA
fYear :
1997
fDate :
26-30 Jan 1997
Firstpage :
454
Lastpage :
459
Abstract :
Rotary electrostatic microactuators suitable for use in a two-stage servo system for magnetic disk drives have been fabricated using the HexSil process. A 2.6 mm diameter device is shown to be capable of producing 0.17 mN-mm of output torque, corresponding to a predicted actuation bandwidth of 1.6 kHz. The structures are formed from LPCVD polysilicon deposited into deep trenches etched into a silicon mold wafer. Upon release, these structures are transferred to a target wafer using a solder bond. The solder bonding process will provide easy integration of mechanical structures with integrated circuits, allowing separate optimization of the circuit and structure fabrication processes. An advantage of HexSil is that once the mold wafer has undergone the initial plasma etching, it may be re-used for subsequent polysilicon depositions, amortizing the cost of the deep trench etching over many structural runs and thereby significantly reducing the cost of finished actuators. Further, 100 μm high structures may be made from a 3 μm deposition of polysilicon, increasing overall fabrication speed
Keywords :
chemical vapour deposition; electrostatic devices; elemental semiconductors; hard discs; microactuators; semiconductor growth; silicon; sputter etching; wafer bonding; 1.6 kHz; 100 micron; 2.6 mm; HexSil process; LPCVD; Si; actuation bandwidth; angular micropositioner; deep trenches; disk drives; fabrication speed; mechanical structures; mold wafer; output torque; plasma etching; polysilicon; rotary electrostatic microactuators; solder bonding process; two-stage servo system; Bandwidth; Costs; Disk drives; Electrostatics; Etching; Fabrication; Magnetic separation; Microactuators; Servomechanisms; Torque;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1997. MEMS '97, Proceedings, IEEE., Tenth Annual International Workshop on
Conference_Location :
Nagoya
ISSN :
1084-6999
Print_ISBN :
0-7803-3744-1
Type :
conf
DOI :
10.1109/MEMSYS.1997.581890
Filename :
581890
Link To Document :
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