• DocumentCode
    3429609
  • Title

    Forming carbon films on cemented carbide surface using RF PCVD method

  • Author

    Grabarczyk, J. ; Niedzielski, P. ; Louda, P.

  • Author_Institution
    Div. of Thin Films, Tech. Univ. Lodz, Poland
  • fYear
    2001
  • fDate
    26-30 June 2001
  • Firstpage
    110
  • Lastpage
    111
  • Abstract
    The aim of the project described in this paper was to examine the influence parameters of deposition and the method of location of samples on an RF-power electrode in the RF-PCVD method on the structure of carbon coatings, which covered cemented carbide substrates. This researches precedes an investigation concerning the covering of cemented carbide cutting tools by wear resistant carbon films, with were used in wood industry for milling of wood-base materials. As an object of investigation cutter head plates made of cemented carbide were used. Their size was about 30/spl times/12/spl times/1.5. In the deposition processes two types of parameters were applied: so-called "hard" parameters, when the bias voltage was higher then 500V, and "soft" parameters, when the bias voltage was less then 400V. In addition the flow of methane, pressure, and time of deposition were changed. In order to properly locate the cutting edge on the electrode three types of holders were used. Every process of depositing the carbon film on a cemented carbide substrate was preceded by one hour of ion etching.
  • Keywords
    carbon; plasma CVD coatings; scanning electron microscopy; wear resistant coatings; 400 V; 500 V; C; C film; PECVD; WC; bias voltage; deposition parameters; wear resistant films; Building materials; Coatings; Cutting tools; Electrodes; Milling; Organic materials; Radio frequency; Substrates; Voltage; Wood industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Layers, 2001. Abstract Book. 3rd International Conference on Novel Applications of
  • Conference_Location
    Zakopane, Poland
  • Print_ISBN
    0-7803-7136-4
  • Type

    conf

  • DOI
    10.1109/WBL.2001.946562
  • Filename
    946562