DocumentCode :
3429664
Title :
Modeling and simulation of sol-gel thin films for monolithic microwave integrated circuit applications
Author :
Lazim, N.F.M. ; Awang, Zaiki ; Herman, Shukreen Hana ; Nor, Uzer Mohd
Author_Institution :
Microwave Technol. Center, Universiti Teknologi MARA, Malaysia
fYear :
2005
fDate :
20-21 Dec. 2005
Abstract :
This paper reports on the feasibility study of using sol gel lead zirconate titanate for monolithic microwave integrated circuit (MMIC) thin film capacitors. The films were modeled as thin film microstrip lines (TFMS) and their microwave behaviour was simulated using a commercially available electromagnetic simulator Sonnet. The capacitances were calculated for film thicknesses ranging from 0.1 - 0.3 μm and with dielectric constant from 100 - 1000 over the frequency range of 1 to 100 GHz. In addition, the characteristic impedances of various TFMS lines were also calculated for different line widths. For a 500 dielectric constant/1 μm film thickness structure, the width obtained for a 50 Ω is less than 1 μm. Results of this study show that the proposed sol-gel material can be used for efficient size reduction in MMIC.
Keywords :
MMIC; integrated circuit modelling; lead compounds; microstrip lines; permittivity; sol-gel processing; thin film capacitors; 0.1 to 0.3 mum; 1 to 100 GHz; MMIC; PZT; PbZrO3TiO3; characteristic impedance; dielectric constant; electromagnetic simulator Sonnet; film thickness structure; monolithic microwave integrated circuit applications; sol gel lead zirconate titanate; sol-gel thin films; thin film capacitors; thin film microstrip lines; Application specific integrated circuits; Circuit simulation; Dielectric constant; Dielectric thin films; Integrated circuit modeling; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Thin film circuits; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Electromagnetics, 2005. APACE 2005. Asia-Pacific Conference on
Print_ISBN :
0-7803-9431-3
Type :
conf
DOI :
10.1109/APACE.2005.1607829
Filename :
1607829
Link To Document :
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