• DocumentCode
    3429684
  • Title

    Changes in electrical properties of thin diamond films under heat treatment

  • Author

    Kulesza, S. ; Rozploch, F.

  • Author_Institution
    Inst. of Phys., Nicholas Copernicus Univ., Torun, Poland
  • fYear
    2001
  • fDate
    26-30 June 2001
  • Firstpage
    125
  • Abstract
    The authors present results on both temperature-dependent resistivity (/spl rho/(T)) measurements and current-voltage (I(V)) characteristics of polycrystalline diamond thin films chemically vapour deposited by hot filament (HF-CVD) method from propane-butane gas mixture diluted in hydrogen. The films were deposited on single crystal silicon substrates. In-plane and out-of-plane I-V characteristics of the same sample are shown and observed differences are discussed, which clearly attest to concurrent transport mechanisms in the films. Then, changes in the samples resistivity under heat treatment in vacuum are presented. The authors show that a simple exponential /spl rho/(T) model is inadequate to explain the results, since distinctive peaks are found in the characteristics. Further, observed changes are analysed in terms of gradual dehydrogenation of the samples. The results indicate that electrical properties of CVD diamond films may be to some extent controlled by their proper dehydrogenation either in vacuum or in an inert gas atmosphere.
  • Keywords
    CVD coatings; annealing; diamond; electrical resistivity; electron mobility; elemental semiconductors; heat treatment; semiconductor thin films; thermoelectricity; C; CVD; I-V characteristics; annealed; current-voltage characteristics; dehydrogenation; electrical properties; heat treatment; temperature-dependent resistivity; thin diamond films; Chemical vapor deposition; Conductivity; Current measurement; Heat treatment; Hydrogen; Resistance heating; Semiconductor films; Silicon; Sputtering; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wide Bandgap Layers, 2001. Abstract Book. 3rd International Conference on Novel Applications of
  • Conference_Location
    Zakopane, Poland
  • Print_ISBN
    0-7803-7136-4
  • Type

    conf

  • DOI
    10.1109/WBL.2001.946569
  • Filename
    946569