DocumentCode
3431359
Title
Strategies of energy saving in a wafer fab
Author
Tsai, Chun-Hung ; Hsiao, Patrick ; Kuo, Rong-Chang ; Chang, Chung-Chieh ; Rao, Muchen ; Chang, Chin-Kuo ; Chung, Kung-Yao
Author_Institution
United Microelectron. Corp., Hsinchu, Taiwan
fYear
2002
fDate
10-11 Dec. 2002
Firstpage
85
Lastpage
89
Abstract
Energy saving on a semiconductor fab is a big issue from the cost reduction point of view. This paper summarizes some effective actions carried out in our fab. We found that lowering the temperature setting in the make-up air unit (MAU) outlet can save as much as NT$ 5.6 million per year. Adjusting the amount of exhaust of processing equipment to a reasonable level can also reduce large amounts of the running cost. Furthermore, adding heat recovery coils into a traditional MAU can reduce both cooling load and heating load. All the energy-saving actions can serve as valuable references to other semiconductor fabs.
Keywords
cost reduction; energy conservation; heat recovery; process heating; semiconductor device manufacture; cooling load; cost reduction; energy consumption; energy saving strategies; heat recovery coils; heating load; semiconductor fabrication; semiconductor manufacture; wafer fab; Coils; Cooling; Costs; Energy consumption; Environmental economics; Heat recovery; Heating; Microelectronics; Power generation economics; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Technology Workshop, 2002
Print_ISBN
0-7803-7604-8
Type
conf
DOI
10.1109/SMTW.2002.1197375
Filename
1197375
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