• DocumentCode
    3431359
  • Title

    Strategies of energy saving in a wafer fab

  • Author

    Tsai, Chun-Hung ; Hsiao, Patrick ; Kuo, Rong-Chang ; Chang, Chung-Chieh ; Rao, Muchen ; Chang, Chin-Kuo ; Chung, Kung-Yao

  • Author_Institution
    United Microelectron. Corp., Hsinchu, Taiwan
  • fYear
    2002
  • fDate
    10-11 Dec. 2002
  • Firstpage
    85
  • Lastpage
    89
  • Abstract
    Energy saving on a semiconductor fab is a big issue from the cost reduction point of view. This paper summarizes some effective actions carried out in our fab. We found that lowering the temperature setting in the make-up air unit (MAU) outlet can save as much as NT$ 5.6 million per year. Adjusting the amount of exhaust of processing equipment to a reasonable level can also reduce large amounts of the running cost. Furthermore, adding heat recovery coils into a traditional MAU can reduce both cooling load and heating load. All the energy-saving actions can serve as valuable references to other semiconductor fabs.
  • Keywords
    cost reduction; energy conservation; heat recovery; process heating; semiconductor device manufacture; cooling load; cost reduction; energy consumption; energy saving strategies; heat recovery coils; heating load; semiconductor fabrication; semiconductor manufacture; wafer fab; Coils; Cooling; Costs; Energy consumption; Environmental economics; Heat recovery; Heating; Microelectronics; Power generation economics; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Technology Workshop, 2002
  • Print_ISBN
    0-7803-7604-8
  • Type

    conf

  • DOI
    10.1109/SMTW.2002.1197375
  • Filename
    1197375