Title :
A method to improve field alignment registration accuracy in VLSI lithography
Author :
Liu, Jianhai ; Wang, Bin ; Zhang, Xiaoping ; Li, Bing-Zong
Author_Institution :
Adv. Semicond. Manuf. Corp., Shanghai, China
Abstract :
A method which put some base marks onto a wafer prior to the first layer exposure to improve the registration accuracy of a field alignment lithographic system like Ultratech 1500 stepper has been introduced. The method can avoid a production disaster which may seriously affect the package yield and provide a high device yield, similar to the average yield of conventional processed lots
Keywords :
VLSI; integrated circuit yield; photolithography; Ultratech 1500 stepper; VLSI lithography; field alignment registration accuracy; package yield; Lithography; Manufacturing; Mechanical systems; Packaging; Production systems; Resists; Semiconductor device manufacture; Silicon compounds; Substrates; Very large scale integration;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785813
