DocumentCode :
343166
Title :
Microelectronic packaging trends: Materials and Processes
Author :
Chen, W.T. ; Lahiri, S.K.
fYear :
1998
fDate :
1998
Firstpage :
540
Lastpage :
540
Keywords :
Assembly; Consumer electronics; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Manufacturing industries; Manufacturing processes; Microelectronics; Semiconductor device packaging; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Print_ISBN :
0-7803-4306-9
Type :
conf
DOI :
10.1109/ICSICT.1998.785941
Filename :
785941
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=343166
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