DocumentCode
343218
Title
Synthesis of SiC using ion beam and PECVD
Author
Yang, Liun ; Chen, Changqing ; Ren, Congxin ; Yan, Jinlong ; Chen, Xueliang
Author_Institution
Inst. of Metall., Acad. Sinica, Shanghai, China
fYear
1998
fDate
1998
Firstpage
811
Lastpage
814
Abstract
SiC films were synthesized by ion implantation, ion beam enhanced deposition, reactive ion beam sputtering and plasma enhanced chemical vapor deposition (PECVD). P-type (100) Si was implanted with 60 keV C + at different temperatures to form a SiC buried layer. Implanting at 680°C, there are two apparent XRD peaks due to the β-SiC(200) and (400) reflections in as implanted samples. Ion beam enhanced deposition could be adopt to prepare amorphous SiC films containing SiC bonds whose absorption bands located at 800 cm-1 . Hydrogenated amorphous SiC films were synthesized by reactive ion beam sputtering deposition. Meanwhile, hydrogenate amorphous SiC film which can exhibit green photoluminescence at room temperature were prepared by PECVD
Keywords
amorphous semiconductors; bonds (chemical); buried layers; hydrogen; ion beam assisted deposition; ion implantation; noncrystalline structure; photoluminescence; plasma CVD; semiconductor growth; semiconductor thin films; silicon compounds; sputter deposition; wide band gap semiconductors; β-SiC; 20 C; 680 C; 800 cm-1; P-type (100) Si; PECVD; SiC; SiC bonds; SiC buried layer; SiC:H; XRD peaks; amorphous SiC films; green photoluminescence; hydrogenated amorphous SiC films; ion beam enhanced deposition; ion implantation; plasma enhanced chemical vapor deposition; reactive ion beam sputtering; room temperature; synthesis; Amorphous materials; Chemical vapor deposition; Ion beams; Ion implantation; Optical films; Plasma chemistry; Plasma immersion ion implantation; Plasma temperature; Silicon carbide; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.786161
Filename
786161
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