• DocumentCode
    3432180
  • Title

    An evaluation method of electromagnetic shielding applied to microwave surface mount components

  • Author

    Ishitobi, N. ; Shimoda, Haruhisa ; Yasukawa, Yukiko ; Miura, Tsuyoshi ; Nakai, Shohei ; Yasuda, Norihito

  • Author_Institution
    Adv. Products Dev. Centre, TDK Corp., Chiba
  • fYear
    1995
  • fDate
    4-6 Dec 1995
  • Firstpage
    347
  • Lastpage
    350
  • Abstract
    A major problem associated with surface mount components housed within a single large shield case is that a small amount of leakage energy may lead to parasitic coupling between different sub-circuits. A method to counteract such a coupling mechanism is described. First, the cavity modes are calculated from the physical dimensions of the shield case which are in turn limited by the dimensions of the mobile communications terminal. The effect of resonant cavity modes on the system is then described. Next, the design of a TEM-cell, for the evaluation of leakage energy from components mounted on a PCB surface is demonstrated. An evaluation method for use with this equipment is also proposed. Finally, the structure of a remodeled surface mount BPF is presented. The results of the BPF evaluation using the TEM-Cell are shown
  • Keywords
    band-pass filters; cavity resonators; electromagnetic shielding; microwave filters; mobile communication; surface mount technology; BPF; PCB surface; TEM-cell; band-pass filters; cavity modes; coupling mechanism; electromagnetic shielding; leakage energy; microwave surface mount components; mobile communications terminal; parasitic coupling; resonant cavity modes; Band pass filters; Circuit simulation; Electromagnetic shielding; Microwave devices; Microwave theory and techniques; RLC circuits; Radio frequency; Resonance; Resonant frequency; Telephony;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
  • Conference_Location
    Omiya
  • Print_ISBN
    0-7803-3622-4
  • Type

    conf

  • DOI
    10.1109/IEMT.1995.541059
  • Filename
    541059