The basic process parameters and reliability evaluation results for the new IC-Card packaging method by using transfer molding

Author

Sakurai, Keizou ; Inui, Katsunori

Author_Institution

Component Technol. Dev., IBM Japan Ltd., Shiga, Japan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

355

Lastpage

359

Abstract

The IC-Card demand has been increasing according to mobile PC market or other electrical product growth, of which main fascination is to be able to obtain easily the additional functions. On the other hand, the IC-Card packaging technology is required to investigate the larger parts mount space and the stronger structure. Generally, the current IC-Card packaging uses the metal cover and plastic frame. New developed IC-Card packaging in this paper does not use such as a metal cover and plastic frame, but only transfer mold technology as its process. The evaluation results and superiorities of THE NEW PACKAGING are reported in this paper comparing JEIDA standards and current other packaging performances

Keywords

integrated circuit packaging; integrated circuit reliability; smart cards; IC-Card packaging; electrical product; mobile PC; process parameters; reliability; transfer molding; Assembly; Performance evaluation; Plastic packaging; Product design; Resins; Space technology; Stress; Testing; Transfer molding; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541061

Filename

541061