The basic process parameters and reliability evaluation results for the new IC-Card packaging method by using transfer molding

The IC-Card demand has been increasing according to mobile PC market or other electrical product growth, of which main fascination is to be able to obtain easily the additional functions. On the other hand, the IC-Card packaging technology is required to investigate the larger parts mount space and the stronger structure. Generally, the current IC-Card packaging uses the metal cover and plastic frame. New developed IC-Card packaging in this paper does not use such as a metal cover and plastic frame, but only transfer mold technology as its process. The evaluation results and superiorities of THE NEW PACKAGING are reported in this paper comparing JEIDA standards and current other packaging performances