DocumentCode
3432683
Title
Solving static related problems in packaging, marking, and test
Author
Tan, Wayne ; Steinman, Arnold
Author_Institution
Adv. Micro Devices Inc., Sunnyvale, CA, USA
fYear
1995
fDate
4-6 Dec 1995
Firstpage
360
Lastpage
364
Abstract
Static charge is a cause of yield loss in semiconductor manufacturing, from cleanroom front ends to backend assembly, including testing, marking, and packaging. This paper explores methods of static charge generation and control in robotics, pick-and-place handlers, and other production tools commonly found in backend assembly, packaging, and test areas. The basics of using ionization for static charge control will be discussed
Keywords
semiconductor device manufacture; semiconductor device packaging; semiconductor device testing; static electrification; backend assembly; cleanroom front end; ionization; marking; packaging; pick-and-place handlers; production tools; robotics; semiconductor manufacturing; static charge control; testing; yield; Automatic control; Conducting materials; Electrostatic discharge; Packaging machines; Production equipment; Production facilities; Robotic assembly; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location
Omiya
Print_ISBN
0-7803-3622-4
Type
conf
DOI
10.1109/IEMT.1995.541062
Filename
541062
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