Title :
Solving static related problems in packaging, marking, and test
Author :
Tan, Wayne ; Steinman, Arnold
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
Static charge is a cause of yield loss in semiconductor manufacturing, from cleanroom front ends to backend assembly, including testing, marking, and packaging. This paper explores methods of static charge generation and control in robotics, pick-and-place handlers, and other production tools commonly found in backend assembly, packaging, and test areas. The basics of using ionization for static charge control will be discussed
Keywords :
semiconductor device manufacture; semiconductor device packaging; semiconductor device testing; static electrification; backend assembly; cleanroom front end; ionization; marking; packaging; pick-and-place handlers; production tools; robotics; semiconductor manufacturing; static charge control; testing; yield; Automatic control; Conducting materials; Electrostatic discharge; Packaging machines; Production equipment; Production facilities; Robotic assembly; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541062
