Title :
A low-phase-noise 76-GHz planar Gunn VCO using flip-chip bonding technology
Author :
Yoshida, Takashi ; Fukasawa, Yoshimichi ; Deguchi, Tadayoshi ; Kawaguchi, Kiyoshi ; Sugiyama, Takahiro ; Nakagawa, Atsushi
Author_Institution :
Res. Lab., New Japan Radio Co., Ltd., Saitama, Japan
Abstract :
A low-phase-noise 76-GHz planar Gunn VCO using flip-chip bonding technology has been developed. This device demonstrates sufficient RF performance for use in automotive radar systems. The power consumption is 1.9 W at a bias voltage of 3.3 V. The measured output power is 13.5 dBm at 76.4 GHz, with a DC-RF conversion efficiency of 1.2%. The Gunn oscillator achieves a significantly low phase noise of -104 dBc/Hz at a 1-MHz offset frequency, because of its fundamental-mode operation. To our knowledge, this is the lowest reported phase noise in this frequency range. A tuning range of 210 MHz is obtained at a center frequency of 76.5 GHz in the tuning voltage range from 0 to 10 V. The output power averages 13.9 dBm and exhibits variation of less than 0.8 dB. The device exhibits excellent modulation linearity of less than 2.4%. Overall, this Gunn VCO exhibits excellent phase-noise performance, high output power, and good modulation linearity. The adoption of flip-chip bonding technology is expected to enable low-cost mass production and good reproducibility.
Keywords :
Gunn oscillators; bonding processes; flip-chip devices; millimetre wave oscillators; phase noise; voltage-controlled oscillators; 0 to 10 V; 1 MHz; 1.9 W; 210 MHz; 76.5 GHz; Gunn oscillator; automotive radar systems; flip-chip bonding; phase-noise; planar Gunn VCO; Automotive engineering; Bonding; Gunn devices; Linearity; Phase noise; Power generation; Radio frequency; Tuning; Voltage; Voltage-controlled oscillators;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1608833