Title :
The use of the FPC-laser method for different chip interconnection techniques
Author :
Azdasht, G. ; Kasulke, P. ; Zakel, E. ; Reichl, Und H.
Author_Institution :
Technologien der Mikroperipherik, Tech. Univ. Berlin, Germany
Abstract :
The reproducibility of the laser connection within micro interconnection technology depends on the absorption quality of the contact material and the thermal interconnection. The Fibre Push Connection System (FPC) allows contacts of high reproducibility due to thermal contact between two parts and the high absorption of the laser energy by this system. The different applications of the FPC-System will be presented. The used metallurgy of contact parts are AuSn/Au and AuSn/Ni. The same machine concept is applied for flip chip on flexible substrates
Keywords :
flip-chip devices; integrated circuit interconnections; laser materials processing; AuSn-Au; AuSn-Ni; FPC laser method; chip interconnection technology; energy absorption; fibre push connection system; flexible substrate; flip chip; metallurgy; thermal contact; Absorption; Bonding; Copper; Fiber lasers; Integrated circuit interconnections; Joining processes; Lead; Reproducibility of results; Soldering; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541071
