Test structures for analyzing the mechanisms of wafer chemical contaminant removal

Author

Yan, J. ; Barnaby, H.J. ; Vermiere, B. ; Peterson, T. ; Shadman, F.

Author_Institution

Chem. & Environ. Eng., Arizona Univ., Tucson, AZ, USA

fYear

2003

fDate

17-20 March 2003

Firstpage

209

Lastpage

213

Abstract

An electrochemical sensor (trench device) is designed to measure wafer contaminant concentrations during ultra-pure water rinses. Electrical measurements on these structures enable the identification and modeling of the mechanisms of chemical contaminant removal from patterned and unpatterned wafers, thereby facilitating the reduction of rinse time and water consumption without sacrificing overall wafer cleanliness.

Keywords

electrochemical sensors; integrated circuit measurement; isolation technology; surface cleaning; surface contamination; chemical contaminant removal mechanism identification; electrical measurements; electrochemical sensor trench device; modeling; rinse time reduction; test structures; ultrapure water rinses; wafer chemical contaminant removal mechanisms; wafer cleanliness; wafer contaminant concentrations; water consumption reduction; Chemical analysis; Chemical sensors; Cleaning; Design engineering; Electric variables measurement; Etching; Fabrication; Isolation technology; Pollution measurement; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures, 2003. International Conference on

Print_ISBN

0-7803-7653-6

Type

conf

DOI

10.1109/ICMTS.2003.1197463

Filename

1197463