DocumentCode
3433368
Title
Definition of new polymer packaging solutions for airborne power electronic system applications
Author
Charlas, M. ; Nassiet, V. ; Habas, J.-P. ; Vieillard, S. ; Meuret, R.
Author_Institution
LGP-ENIT, Tarbes
fYear
2009
fDate
10-13 Feb. 2009
Firstpage
1
Lastpage
6
Abstract
This research work presents the scientific approach used to qualify polymers for airborne power electronic packaging. Three types of polymer were studied, each of them having to fulfil specific function in a power module. Firstly, four high temperature polymers were pre-selected for external housing and their properties were investigated in two model ageing environments. Very different ageing mechanisms were detected depending on the nature of the exposure medium. The second part of this work dealt with the definition of the curing cycle of a silicone adhesive that must be used to assemble various structural parts of the power module. A similar experimental approach was proposed to optimise the properties of a thermoset polymer used for the flexible encapsulation of electronic components.
Keywords
ageing; avionics; electronics packaging; encapsulation; modules; polymers; power electronics; ageing model; airborne power electronic system applications; encapsulation; high temperature polymers; polymer packaging; power module; silicone adhesive; thermoset polymer; Aging; Assembly; Curing; Electronic components; Electronics packaging; Encapsulation; Multichip modules; Polymers; Power electronics; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2009. ICIT 2009. IEEE International Conference on
Conference_Location
Gippsland, VIC
Print_ISBN
978-1-4244-3506-7
Electronic_ISBN
978-1-4244-3507-4
Type
conf
DOI
10.1109/ICIT.2009.4939628
Filename
4939628
Link To Document