• DocumentCode
    3433368
  • Title

    Definition of new polymer packaging solutions for airborne power electronic system applications

  • Author

    Charlas, M. ; Nassiet, V. ; Habas, J.-P. ; Vieillard, S. ; Meuret, R.

  • Author_Institution
    LGP-ENIT, Tarbes
  • fYear
    2009
  • fDate
    10-13 Feb. 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This research work presents the scientific approach used to qualify polymers for airborne power electronic packaging. Three types of polymer were studied, each of them having to fulfil specific function in a power module. Firstly, four high temperature polymers were pre-selected for external housing and their properties were investigated in two model ageing environments. Very different ageing mechanisms were detected depending on the nature of the exposure medium. The second part of this work dealt with the definition of the curing cycle of a silicone adhesive that must be used to assemble various structural parts of the power module. A similar experimental approach was proposed to optimise the properties of a thermoset polymer used for the flexible encapsulation of electronic components.
  • Keywords
    ageing; avionics; electronics packaging; encapsulation; modules; polymers; power electronics; ageing model; airborne power electronic system applications; encapsulation; high temperature polymers; polymer packaging; power module; silicone adhesive; thermoset polymer; Aging; Assembly; Curing; Electronic components; Electronics packaging; Encapsulation; Multichip modules; Polymers; Power electronics; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Technology, 2009. ICIT 2009. IEEE International Conference on
  • Conference_Location
    Gippsland, VIC
  • Print_ISBN
    978-1-4244-3506-7
  • Electronic_ISBN
    978-1-4244-3507-4
  • Type

    conf

  • DOI
    10.1109/ICIT.2009.4939628
  • Filename
    4939628