• DocumentCode
    3433749
  • Title

    Pure silver surface layer on the oxidized Ag-Sn-In material

  • Author

    Shen, Yuan-Shou ; Lima, Antonio M.

  • Author_Institution
    Engelhard Corp., Plainville, MA, USA
  • fYear
    1988
  • fDate
    26-29 Sept. 1988
  • Firstpage
    13
  • Lastpage
    15
  • Abstract
    One of the drawbacks of internally oxidized Ag-Sn-Al alloy is that a pure silver layer always appears on the oxidized material surface after oxidation. Although the thickness of the pure silver layer varies only between 0.0002 and 0.001 in. (0.005 to 0.025 mm), the silver layer always causes light tack welding in the early stage of a switching operation. The severity depends on the device´s mechanical design as well as the electric current. The surfaces of several Ag alloys were examined under an optical microscope and cross sections were then taken and investigated by the standard metallography method. It is found that one pure silver surface of the Ag-Sn-In material can be eliminated by oxidizing the material from one side.<>
  • Keywords
    composite materials; electrical contacts; indium compounds; oxidation; silver; silver alloys; tin compounds; 0.0002 to 0.001 in; Ag film elimination; Ag layer; Ag-SnO/sub 2/-In/sub 2/O/sub 3/ contacts; cross sections; electric current; internal oxidation; mechanical design; standard metallography method; tack welding; Conducting materials; Corrugated surfaces; Displays; Indium; Inorganic materials; Optical materials; Optical microscopy; Oxidation; Silver; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Type

    conf

  • DOI
    10.1109/HOLM.1988.16089
  • Filename
    16089