DocumentCode :
3433993
Title :
Analysis and diagnosis of multiple simultaneous defects
Author :
Ladhar, Aymen ; Masmoudi, Mohamed
Author_Institution :
Micro-Technol. & Commun. Lab. Sfax, STMicroelectron., Sfax, Tunisia
fYear :
2009
fDate :
13-16 Dec. 2009
Firstpage :
671
Lastpage :
674
Abstract :
In this paper, we present a new approach to diagnose multiple manufacturing defects affecting digital integrated circuits (IC). The method treats each failing pattern as an independent diagnosis, and finds out the location of potential candidates when they are simultaneously simulated explain each failing pattern. Our methodology consists in three main steps and can diagnose three types of multiple defect configurations. Experiments were performed in good ICs in which different types of multiple faults were injected. The correct fault locations and cause were predicted in all cases.
Keywords :
digital integrated circuits; digital integrated circuits; fault locations; multiple simultaneous defect diagnosis; Circuit faults; Digital integrated circuits; Failure analysis; Fault detection; Fault diagnosis; Integrated circuit manufacture; Laboratories; Manufacturing processes; Partitioning algorithms; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
Conference_Location :
Yasmine Hammamet
Print_ISBN :
978-1-4244-5090-9
Electronic_ISBN :
978-1-4244-5091-6
Type :
conf
DOI :
10.1109/ICECS.2009.5410808
Filename :
5410808
Link To Document :
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