DocumentCode :
3434157
Title :
Design and Testing of an Integrated Circuit for Multi-Electrode Neural Recording
Author :
Harrison, Reid R. ; Watkins, Paul T. ; Kier, Ryan J. ; Black, Daniel J. ; Lovejoy, Robert O. ; Normann, Richard A. ; Solzbacher, Florian
Author_Institution :
Dept. of Electr. & Comput. Eng., Utah Univ., Salt Lake City, UT
fYear :
2007
fDate :
6-10 Jan. 2007
Firstpage :
907
Lastpage :
912
Abstract :
The authors have developed a single-chip neural recording system with wireless power delivery and telemetry. The 0.5-mum CMOS IC is designed to be bonded to the back of a 100-channel Utah electrode array. A pad near each amplifier allows connection of the chip to the MEMS electrode array. The complete integrated neural interface receives power wirelessly through a 2.64-MHz inductive link. A clock, regulated supply, and commands are derived from the power signal .The neural amplifiers each have a gain of 60 dB. A 10-bit charge-redistribution ADC is used to digitize the signal from one amplifier selected with an analog MUX. Digitizing all channels simultaneously would generate prohibitively high data rates; therefore, the authors perform data reduction by incorporating one-bit "spike detectors" into each amplifier. Neural data is transmitted off chip using an integrated 433-MHz FSK transmitter. The chip measures 4.7 times 5.9 mm and consumes 13.5 mW of power
Keywords :
CMOS integrated circuits; analogue-digital conversion; integrated circuit design; integrated circuit testing; micromechanical devices; neural chips; telemetry; 0.5 micron; 1 bit; 10 bit; 13.5 mW; 2.64 MHz; 433 MHz; 60 dB; CMOS integrated circuit; MEMS electrode array; Utah electrode array; analog MUX; charge-redistribution ADC; data reduction; inductive link; integrated FSK transmitter; integrated circuit design; integrated circuit testing; integrated neural interface; multielectrode neural recording; neural amplifiers; spike detectors; telemetry; wireless power delivery; Bonding; CMOS integrated circuits; Circuit testing; Clocks; Electrodes; Gain; Integrated circuit testing; Micromechanical devices; Power amplifiers; Telemetry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2007. Held jointly with 6th International Conference on Embedded Systems., 20th International Conference on
Conference_Location :
Bangalore
ISSN :
1063-9667
Print_ISBN :
0-7695-2762-0
Type :
conf
DOI :
10.1109/VLSID.2007.63
Filename :
4092156
Link To Document :
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