DocumentCode :
3434181
Title :
Active silicon substrate technology for miniaturized ultra high performance processing
Author :
Malek, Homayoun ; Pearson, Richard
Author_Institution :
Lockheed Missiles & Space Co. Inc., Palo Alto, CA, USA
fYear :
1993
fDate :
1993
Firstpage :
346
Lastpage :
357
Abstract :
A multichip module (MCM) technology called active silicon substrate (ASIS) that raises architectural design of signal/data processing systems to much higher levels of microminiaturization and performance is described. The merits of active substrates over the conventional passive ones are demonstrated through the implementation of several features that are possible when active elements are embedded in the interconnecting substrate and mounting platform. These include scalable fault-tolerant computing elements, replaceable drivers/buffers, and embedded local/global self-test circuits. The ASIS technology allows more than one type of processing architecture to be embedded and integrated in the same substrate, thus providing a viable approach for water scale integration.
Keywords :
VLSI; digital integrated circuits; hybrid integrated circuits; integrated circuit technology; multichip modules; silicon; substrates; ASIS technology; MCM; WSI; active Si substrate technology; embedded local/global self-test circuits; interconnecting substrate; miniaturized ultra high performance processing; mounting platform; multichip module; packaging; processing architecture; replaceable drivers/buffers; scalable fault-tolerant computing elements; water scale integration; Built-in self-test; Data processing; Driver circuits; Embedded computing; Fault tolerance; Integrated circuit interconnections; Multichip modules; Signal design; Signal processing; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
Type :
conf
DOI :
10.1109/ICWSI.1993.255243
Filename :
255243
Link To Document :
بازگشت