Title :
Smart 1-3 composites for ultrasonic transducer applications
Author_Institution :
Dept. of Appl. Phys., Hong Kong Polytech. Univ., Kowloon, China
Abstract :
1-3 piezoelectric ceramic/polymer composites, consisting of parallel ceramic rods embedded in a polymer matrix, can convert mechanical energy into electrical energy and vice versa. Thus they are regarded as smart (or intelligent) materials because they can sense changes in the environment and actuate a desired response. In order to design devices based on 1-3 composites, a good understanding of the piezoelectric properties and resonance characteristics is required. This paper reports the fabrication and piezoelectric properties of lead zirconate titanate (PZT)/epoxy and samarium and manganese doped lead titanate (PsmT) fibre/epoxy 1-3 composites. Selected studies of the applications of these 1-3 composites in the Centre for Smart Materials (CSM) at the Hong Kong Polytechnic University are also reported
Keywords :
biomedical measurement; biomedical transducers; biomedical ultrasonics; dielectric resonance; fibre reinforced composites; intelligent materials; lead bonding; lead compounds; manganese; piezoceramics; samarium; ultrasonic transducers; PZT; PZT fibre/epoxy 1-3 composites; PbTiO3:Sm,Mn; PbZrO3TiO3; PsmT fibre/epoxy 1-3 composites; device design; electrical energy; embedded parallel ceramic rods; environmental change; intelligent materials; lead zirconate titanate fibre/epoxy 1-3 composites; mechanical energy conversion; medical ultrasound; piezoelectric properties; polymer matrix; resonance characteristics; samarium/manganese doped lead titanate fibre/epoxy 1-3 composites; smart 1-3 composites; smart 1-3 piezoelectric ceramic/polymer composites; smart materials; ultrasonic transducer applications; wire bonding transducers; Ceramics; Fabrication; Matrix converters; Mechanical energy; Piezoelectric devices; Polymers; Resonance; Samarium; Titanium compounds; Ultrasonic transducers;
Conference_Titel :
Electron Devices Meeting, 2001. Proceedings. 2001 IEEE Hong Kong
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6714-6
DOI :
10.1109/HKEDM.2001.946906