Title :
An advanced version of the electrically programmable hybrid-WSI substrate
Author :
Stopper, Herbert
Author_Institution :
Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
Abstract :
The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.
Keywords :
VLSI; hybrid integrated circuits; integrated circuit technology; multichip modules; packaging; substrates; antifuse; electrically programmable interconnection wafer; hybrid-WSI substrate; multichip modules; thin-film transmission line; wafer scale integration; Active circuits; Electrodes; Fuses; Integrated circuit interconnections; Leakage current; Power transmission lines; Resistors; Robustness; Silicon; Substrates;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255249
