Title :
An advanced MCM associative string processor
Author :
Jalowiecki, I.P. ; Lea, R.M. ; Pedder, D.
Author_Institution :
Brunel Univ., Uxbridge, UK
Abstract :
The HASP4001 hybrid wafer scale integration (HWSI) device, optimized for massively parallel processing, is described. It is a large-area silicon-on-silicon multichip module (MCM-D). The design is based on the experience gained in the implementation of a previous-generation massively parallel computer. It is shown that the resulting module is a significantly more cost-effective system component, minimizing board area and enhancing performance. It is shown that the HWSI incorporates many of the same techniques adopted for the monolithic WSI version, ensuring reliable implementation suitable for medium scale production.
Keywords :
VLSI; multichip modules; parallel architectures; HASP4001; MCM associative string processor; board area; hybrid wafer scale integration; large-area silicon-on-silicon multichip module; massively parallel processing; medium scale production; Application specific processors; Associative processing; Communication networks; Computer architecture; Computer buffers; Concurrent computing; Control systems; Fault tolerance; Global Positioning System; Los Angeles Council;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255266