Title :
Silicon MCMs for parallel computing applications
Author :
McLaren, Moray ; Jamison, Ian
Author_Institution :
Meiko Ltd., Bristol, UK
Abstract :
Multichip module (MCM) technology is used in the design of large-scale, distributed memory, multiple-instruction, multiple-data (MIMD) processors. Two demonstrators have been selected for different applications within a parallel computer. The applications stress various aspects of the technology. The demonstrators are the design of high-performance processing nodes, and the construction of multistage switching networks. In both cases, implementations exist using conventional packaging technology, affording the opportunity to directly compare the performance of the solutions with respect to cost and various other design criteria.
Keywords :
elemental semiconductors; multichip modules; packaging; parallel architectures; silicon; MIMD processors; Si; Si MCMs; cost; high-performance processing nodes; multistage switching networks; packaging technology; parallel computing applications; Application software; Concurrent computing; Costs; Large-scale systems; Multichip modules; Packaging; Parallel processing; Process design; Silicon; Stress;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255267