Title :
Cost modelling for hybrid-WSI massively parallel computing modules
Author :
Habiger, C.M. ; Lea, R.M.
Author_Institution :
Brunel Univ., Uxbridge, UK
Abstract :
Hybrid wafer scale integration (HWSI) is a promising technology for the cost-effective development of the next generation of massively parallel computers (MPCs). It is argued that it is not easy to understand the relative merits and technological tradeoffs associated with vendor-specific factors in order to determine the best technological route for a particular application. Cost models aimed at the resolution of these problems are introduced, and progress towards a design methodology for HWSI devices is reported.
Keywords :
VLSI; hybrid integrated circuits; integrated circuit technology; modules; parallel architectures; HWSI devices; design methodology; hybrid-WSI massively parallel computing modules; vendor-specific factors; Application software; Computer architecture; Concurrent computing; Costs; Manufacturing; Parallel processing; Signal resolution; Silicon; Substrates; Wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255268
