• DocumentCode
    3434637
  • Title

    Cost modelling for hybrid-WSI massively parallel computing modules

  • Author

    Habiger, C.M. ; Lea, R.M.

  • Author_Institution
    Brunel Univ., Uxbridge, UK
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    107
  • Lastpage
    116
  • Abstract
    Hybrid wafer scale integration (HWSI) is a promising technology for the cost-effective development of the next generation of massively parallel computers (MPCs). It is argued that it is not easy to understand the relative merits and technological tradeoffs associated with vendor-specific factors in order to determine the best technological route for a particular application. Cost models aimed at the resolution of these problems are introduced, and progress towards a design methodology for HWSI devices is reported.
  • Keywords
    VLSI; hybrid integrated circuits; integrated circuit technology; modules; parallel architectures; HWSI devices; design methodology; hybrid-WSI massively parallel computing modules; vendor-specific factors; Application software; Computer architecture; Concurrent computing; Costs; Manufacturing; Parallel processing; Signal resolution; Silicon; Substrates; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-7803-0867-0
  • Type

    conf

  • DOI
    10.1109/ICWSI.1993.255268
  • Filename
    255268