Title :
Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project
Author :
Pedder, David J.
Author_Institution :
GEC Plessey Semicond., Swindon, UK
Abstract :
The Interconnection technology for multichip assemblies (ITMA) project is addressing the application of a silicon-substrate-based multichip module (MCM) technology to the requirements of parallel computing applications in the UK. The program involves activities on MCM design methodology, silicon substrate process technology, device assembly, module packaging technology, the design of VLSI devices specifically for MCM applications, and the implementation of advanced MCM demonstrator modules in parallel computing systems. The objectives of the ITMA project are described, and the technologies employed within the project to realize high-performance MCMs and hybrid wafer scale integration (HWSI) modules are reviewed.
Keywords :
VLSI; assembling; multichip modules; packaging; parallel architectures; ITMA; Si; VLSI devices; demonstrator modules; device assembly; hybrid wafer scale integration; interconnection technology; module packaging; multichip assemblies; multichip module; parallel computing; substrate process technology; Assembly; Design methodology; Dielectric substrates; Information technology; Integrated circuit interconnections; Packaging; Parallel processing; Silicon; Testing; Very large scale integration;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255269
