Title :
Thermal analysis of notebook personal computer
Author :
Hisano, Katsumi ; Iwasaki, Hideo ; Ishizuka, Masaru
Author_Institution :
Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
Abstract :
This paper describes a thermal analysis of a notebook personal computer (PC). A numerical analysis was carried out for the whole domain of the PC, excluding display portion. The numerical model includes Si chips, packages, printed circuit boards (PCBs), casing, etc. In the design of a notebook PC, dead space is kept to a minimum, so the characteristic length for Rayleigh number, which represents the property of the heat transfer between components inside the cabinet is lower than its critical value, and natural convection does not occur inside the PC. Hence, thermal analysis can be performed by heat conduction analysis. To reduce computational load, thermal analysis was divided in two stages and calculation was performed on an EWS. Measured and calculated temperature rise of the electronic parts showed good agreement. This led to the conclusion that the present thermal analysis method can be a useful tool for the design of notebook PCs
Keywords :
notebook computers; thermal analysis; EWS; Rayleigh number; Si chip; casing; characteristic length; dead space; design; electronics; heat conduction; heat transfer; notebook personal computer; numerical model; package; printed circuit board; thermal analysis; Computer displays; Electronic packaging thermal management; Heat transfer; Microcomputers; Numerical analysis; Numerical models; Performance analysis; Printed circuits; Space heating; Temperature measurement;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541085