Title :
Effects of intermediate-temperature buffer layers on low-frequency noise performance of GaN based Schottky barriers
Author :
Leung, B.H. ; Chan, N.H. ; Fong, W.K. ; Zhu, C.F. ; Lui, H.F. ; Ng, C.K. ; Wong, K.C. ; Surya, C.
Author_Institution :
Dept. of Electron. & Inf. Eng., Hong Kong Polytech. Univ., China
Abstract :
Gallium nitride based Schottky barriers were fabricated by RF-plasma assisted molecular beam epitaxy. The GaN epitaxial layers were deposited on novel double buffer layers that consisted of an intermediate temperature buffer layer (ITBL) deposited at 690°C and a conventional low temperature buffer layer grown at 500°C. Low frequency excess noise was measured from the diodes. The results demonstrate clear dependency of voltage noise power spectra on the ITBL thickness with substantial reduction in the noise level for an ITBL thickness of 800 nm. The improvement in noise performance was attributed to reduction of defect density in the GaN epitaxial layers by utilization of ITBL in the growth process
Keywords :
1/f noise; III-V semiconductors; Schottky barriers; Schottky diodes; gallium compounds; interface structure; molecular beam epitaxial growth; plasma materials processing; semiconductor device measurement; semiconductor device noise; semiconductor growth; wide band gap semiconductors; 500 C; 690 C; 800 nm; GaN; GaN based Schottky barriers; GaN epitaxial layers; ITBL; ITBL thickness; ITBL utilization; RF-plasma assisted molecular beam epitaxy; defect density; deposition temperature; diode measurements; double buffer layers; gallium nitride based Schottky barriers; growth process; intermediate temperature buffer layer; intermediate-temperature buffer layer effects; low frequency excess noise; low temperature buffer layer; low-frequency noise performance; noise level; noise performance; voltage noise power spectra; Buffer layers; Epitaxial layers; Gallium nitride; III-V semiconductor materials; Low-frequency noise; Molecular beam epitaxial growth; Noise level; Noise reduction; Schottky barriers; Temperature;
Conference_Titel :
Electron Devices Meeting, 2001. Proceedings. 2001 IEEE Hong Kong
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6714-6
DOI :
10.1109/HKEDM.2001.946937