Title :
Antenna-in-Package Technology for Modern Radio Systems
Keywords :
Assembly; Bonding; CMOS technology; Ceramics; Costs; Electronics packaging; Metallization; Silicon; Temperature; Wires;
Conference_Titel :
Antenna Technology Small Antennas and Novel Metamaterials, 2006 IEEE International Workshop on
Print_ISBN :
0-7803-9443-7
DOI :
10.1109/IWAT.2006.1608969
