DocumentCode

3434980

Title

Antenna-in-Package Technology for Modern Radio Systems

Author

Zhang, Y.P.

fYear

2006

fDate

March 6-8, 2006

Firstpage

37

Lastpage

40

Keywords

Assembly; Bonding; CMOS technology; Ceramics; Costs; Electronics packaging; Metallization; Silicon; Temperature; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Antenna Technology Small Antennas and Novel Metamaterials, 2006 IEEE International Workshop on

Print_ISBN

0-7803-9443-7

Type

conf

DOI

10.1109/IWAT.2006.1608969

Filename

1608969