A packaging system for built-in microcircuits in multilayer substrates

Author

Huang, Yu-Jung ; Fang, Fei-Chun ; Hsiau, Kuo-Hong ; Fu, Shen-Li

Author_Institution

Dept. of Electron. Eng., Kaohsiung Polytech. Inst., Kaohsiung, Taiwan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

460

Lastpage

463

Abstract

This paper presents an approach to the development of a packaging system for incorporating passive components such as resistors and capacitors within multilayer substrates. The electrical characteristics of the embedded passive components within the multilayer substrates are analyzed and evaluated by their mathematical models. A heuristic routing algorithm was proposed for the interconnections of the embedded passive components within the multilayer substrates. Experimental results were provided to show that the present proposed system has better performance than a commercial routing tool

Keywords

circuit layout CAD; integrated circuit interconnections; integrated circuit layout; integrated circuit packaging; network routing; built-in microcircuits; electrical characteristics; embedded passive components; heuristic routing algorithm; interconnections; mathematical models; multilayer substrates; packaging system; Capacitors; Dielectric substrates; Electric variables; Electronics packaging; Geometry; Integrated circuit interconnections; Nonhomogeneous media; Process design; Resistors; Routing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541086

Filename

541086