DocumentCode
3435267
Title
Dielectric breakdown in high-K metal gate: Measurement, device level model and application to circuit
Author
Cacho, F. ; Angot, D. ; Saliva, M. ; Mora, P. ; Rafik, M. ; Federspiel, Xavier ; Roy, Didier ; Huard, Vincent
Author_Institution
STMicroelectron., Crolles, France
fYear
2012
fDate
14-18 Oct. 2012
Firstpage
140
Lastpage
143
Abstract
Gate oxide breakdown is an important reliability issue. This mechanism is widely investigated at device level but the development of a compact model and the assessment at circuit level is much more complex to handle. We first characterize soft and hard breakdown with highlighting the different electrical signatures and sign change of the ratio source drain current. Then a transistor-level model of breakdown is presented. The model is calibrated for a large range of breakdown severity. Finally the model is used at circuit level. The impact of breakdown on both static current and frequency of ring oscillator is discussed.
Keywords
electric breakdown; high-k dielectric thin films; measurement systems; reliability; circuit level; compact model; device level model; dielectric breakdown; electrical signatures; gate oxide breakdown; hard breakdown; high-k metal gate; measurement model; ratio source drain current; reliability issue; ring oscillator; sign change; soft breakdown; static current; transistor-level model; Electric breakdown; Integrated circuit modeling; Logic gates; MOS devices; Reliability; Semiconductor device modeling; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4673-2749-7
Type
conf
DOI
10.1109/IIRW.2012.6468940
Filename
6468940
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