Title :
Analysis of 3D conjugate heat transfers in electronics
Author :
Fradin, J.P. ; Molla, L. ; Desaunettes, B.
Author_Institution :
Epsilon Ingenierie, Labege
Abstract :
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research)
Keywords :
boundary-elements methods; electronic engineering computing; finite element analysis; heat transfer; multichip modules; 3D conjugate heat transfer; CPGA224; FLUENT; REBECA-3D; boundary element method; conductive software; convective software; electronic device; multichip module; volume finite method; Boundary conditions; Boundary element methods; Cogeneration; Computational fluid dynamics; Electronics packaging; Heat transfer; Performance evaluation; Temperature; Testing; Thermal conductivity;
Conference_Titel :
European Design and Test Conference, 1997. ED&TC 97. Proceedings
Conference_Location :
Paris
Print_ISBN :
0-8186-7786-4
DOI :
10.1109/EDTC.1997.582357
