DocumentCode
3435423
Title
Analysis of 3D conjugate heat transfers in electronics
Author
Fradin, J.P. ; Molla, L. ; Desaunettes, B.
Author_Institution
Epsilon Ingenierie, Labege
fYear
1997
fDate
17-20 Mar 1997
Firstpage
190
Lastpage
194
Abstract
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software: a conductive software based on the Boundary Element Method (REBECA-3D(R)) and a convective software based on the Volume Finite Method (FLUENT). The methodology is tested on a Multi Chip Module (CPGA224) for which experiments have been performed by the CNRS (French National Center for Scientific Research)
Keywords
boundary-elements methods; electronic engineering computing; finite element analysis; heat transfer; multichip modules; 3D conjugate heat transfer; CPGA224; FLUENT; REBECA-3D; boundary element method; conductive software; convective software; electronic device; multichip module; volume finite method; Boundary conditions; Boundary element methods; Cogeneration; Computational fluid dynamics; Electronics packaging; Heat transfer; Performance evaluation; Temperature; Testing; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1997. ED&TC 97. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7786-4
Type
conf
DOI
10.1109/EDTC.1997.582357
Filename
582357
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