• DocumentCode
    3435447
  • Title

    A generalized time-series data format for efficient exchange, archiving, and analysis of reliability data

  • Author

    Kopley, T.E. ; Dungan, T.E.

  • Author_Institution
    Texas Instrum., Santa Clara, CA, USA
  • fYear
    2012
  • fDate
    14-18 Oct. 2012
  • Firstpage
    161
  • Lastpage
    167
  • Abstract
    We present a generalized time-series data format for reliability data that can be used for all the standard degradation and failure data typically encountered in reliability studies in the semiconductor industry. The format, which we call the Time-Series Data Format or TSDF, allows storage of all metadata associated with a data set, including device under test (DUT) information, split information, stress conditions, measurement definitions, as well as degradation data, and if present, full IV curve data. TSDF can be the foundation of a flexible and useful reliability data analysis platform. It is presented here as a proposal, with the understanding that a common data format would be useful to the reliability community. Suggestions for improvements to the format are welcome.
  • Keywords
    data analysis; electronic engineering computing; failure analysis; information retrieval systems; meta data; semiconductor industry; time series; DUT information; TSDF; device under test; failure data; full IV curve data; generalized time-series data format; metadata; reliability data analysis platform; semiconductor industry; split information; stress conditions; Integrated circuit reliability; Monitoring; Performance evaluation; Stress; Stress measurement; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4673-2749-7
  • Type

    conf

  • DOI
    10.1109/IIRW.2012.6468946
  • Filename
    6468946