Title :
A generalized time-series data format for efficient exchange, archiving, and analysis of reliability data
Author :
Kopley, T.E. ; Dungan, T.E.
Author_Institution :
Texas Instrum., Santa Clara, CA, USA
Abstract :
We present a generalized time-series data format for reliability data that can be used for all the standard degradation and failure data typically encountered in reliability studies in the semiconductor industry. The format, which we call the Time-Series Data Format or TSDF, allows storage of all metadata associated with a data set, including device under test (DUT) information, split information, stress conditions, measurement definitions, as well as degradation data, and if present, full IV curve data. TSDF can be the foundation of a flexible and useful reliability data analysis platform. It is presented here as a proposal, with the understanding that a common data format would be useful to the reliability community. Suggestions for improvements to the format are welcome.
Keywords :
data analysis; electronic engineering computing; failure analysis; information retrieval systems; meta data; semiconductor industry; time series; DUT information; TSDF; device under test; failure data; full IV curve data; generalized time-series data format; metadata; reliability data analysis platform; semiconductor industry; split information; stress conditions; Integrated circuit reliability; Monitoring; Performance evaluation; Stress; Stress measurement; Temperature measurement;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4673-2749-7
DOI :
10.1109/IIRW.2012.6468946