DocumentCode
3435467
Title
Automatic transfer of parametric FEM models into CAD-layout formats for top-down design of microsystems
Author
Lang, M. ; David, D. ; Glesner, M.
Author_Institution
Inst. of Microelectron. Syst., Darmstadt Univ. of Technol., Germany
fYear
1997
fDate
17-20 Mar 1997
Firstpage
200
Lastpage
204
Abstract
A tool for the transfer of solid models used for FEM simulations into different layout formats used by CAD environments is presented. All necessary layers for the fabrication of microcomponents and systems in a given extended commercial CMOS process are generated automatically by this tool. Starting with an acceleration sensor the use of this translator for an application in the top-down design of microsystems with parametric components is described
Keywords
CMOS integrated circuits; circuit layout CAD; digital simulation; finite element analysis; masks; micromechanical devices; CAD-layout formats; acceleration sensor; extended commercial CMOS process; microelectromechanical systems; parametric FEM models; solid models; top-down design; translator; Acceleration; CMOS process; Design automation; Fabrication; Microelectronics; Micromechanical devices; Process design; Semiconductor device modeling; Sensor phenomena and characterization; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1997. ED&TC 97. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7786-4
Type
conf
DOI
10.1109/EDTC.1997.582359
Filename
582359
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