Title :
Probe pulse shape estimation in synthetic aperture method
Author_Institution :
Inst. of Radiophys. & Electron., Acad. of Sci., Kharkov, Ukraine
Abstract :
The synthetic aperture method (SAM) application to subsurface scanning data is discussed in the paper. SAM is known to be one of the most powerful techniques of electromagnetic sounding data processing. The advantages of SAM include the universality of its algorithm and the high resolution capability that it can produce. Images of non-dissipative and low-absorbing media can be efficiently treated with this technique. The applicability of SAM to the processing of data collected from media having non-negligible conductivity is rather limited. It is necessary to note, that such a conductivity is relevant in all moist soils. Thus, SAM needs a modification that will permit to take into account a distortion of the sounding impulse in a conducting medium. A modification of SAM that enables one to take into account the shape of the radiated impulse at a given depth is discussed. Also, two methods of estimation of this shape are proposed: 1. Rough estimation of the transfer function of the medium using its material parameters; 2. Shape pulse estimation using the FDTD technique.
Keywords :
buried object detection; estimation theory; finite difference time-domain analysis; military radar; radar detection; radar imaging; radar resolution; soil; synthetic aperture radar; transfer functions; FDTD technique; conducting medium; electromagnetic sounding data processing; low-absorbing media; moist soil; nondissipative media; nonnegligible conductivity; probe pulse shape estimation; radiated impulse; resolution; rough estimation; shape pulse estimation; sounding impulse; subsurface scanning data; synthetic aperture method; unexploded munitions; Conducting materials; Conductivity; Data processing; Finite difference methods; Probes; Pulse shaping methods; Shape; Soil; Time domain analysis; Transfer functions;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1999. IEEE
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5639-x
DOI :
10.1109/APS.1999.788303