DocumentCode :
3436346
Title :
Energy-efficient logic BIST based on state correlation analysis
Author :
Chen, Xiaoding ; Hsiao, Michael S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Virginia Tech, Blacksburg, VA, USA
fYear :
2003
fDate :
27 April-1 May 2003
Firstpage :
267
Lastpage :
272
Abstract :
We present a new low-power BIST (built-in-self-test) for sequential circuits. State correlation analysis is first performed on the flip-flop values in the relaxed, compacted sequence for the undetected faults to extract spatial correlations among the flip-flops. The extracted spatial correlation matrix not only provides additional metrics through which the scan order may be altered, but also allows us to omit some flip-flops in the scan chain. By leaving flip-flops that need less control out of the scan chain, we can reduce transitions on those flip-flops, thereby reducing the overall power and energy. The omission of flip-flops are done in a way that the fault coverage is unaffected. Furthermore, reordering of the flip-flops in the scan chain allows the generated patterns to be more compatible with the state sequence necessary for exciting the random-pattern-resistant faults. Our experiments show that the same or higher fault coverage can be achieved with less energy (and average power) - average power of 48.5% is reduced, with the maximum reduction of 73%.
Keywords :
VLSI; built-in self test; correlation theory; flip-flops; integrated circuit testing; integrated logic circuits; logic testing; low-power electronics; matrix algebra; sequential circuits; VLSI circuits; built-in-self-test; energy-efficient logic BIST; fault coverage; flip-flop reordering; flip-flop values; low-power BIST; random-pattern-resistant faults; scan chain; sequential circuits; spatial correlation matrix; state correlation analysis; Built-in self-test; Circuit faults; Circuit testing; Energy consumption; Energy efficiency; Flip-flops; Hardware; Logic; Sequential circuits; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Test Symposium, 2003. Proceedings. 21st
ISSN :
1093-0167
Print_ISBN :
0-7695-1924-5
Type :
conf
DOI :
10.1109/VTEST.2003.1197662
Filename :
1197662
Link To Document :
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