DocumentCode
3436644
Title
Parallel SOLVE for direct circuit simulation on a transputer array
Author
Chu, Yul ; Mahmood, Ausif ; Lynch, Donald J.
Author_Institution
Washington State Univ., Richland, WA, USA
fYear
1996
fDate
19-22 Dec 1996
Firstpage
27
Lastpage
32
Abstract
Sparse matrix solution (SOLVE) is a dominant part of the total execution time in a circuit simulation program such as SPICE. For simulation of modern VLSI circuit designs, it is important that this time be reduced. This paper presents a block partitionable sparse matrix solution algorithm in which a matrix is divided into equal size blocks, and blocks are assigned to different processors for parallel execution. The algorithm developed in this work exploits sparsity at the block level as well as within a non-zero block. An efficient mapping scheme to assign matrix blocks to processors is developed which maximizes concurrency and minimizes communication between processors. Associated reordering and efficient sparse storage schemes are also developed. An implementation of this parallel algorithm is carried out on a Transputer processor array which plugs into a PC bus. The sparse matrix solver is tested on matrices generated from a transistor-level expansion of ISCAS-85 benchmark logic circuits. Good speedup is obtained for all benchmark matrices up to the number of Transputers available
Keywords
circuit CAD; circuit analysis computing; parallel algorithms; sparse matrices; SOLVE; SPICE; benchmark logic circuits; block partitionable sparse matrix solution; circuit simulation; direct circuit simulation; mapping scheme; parallel algorithm; reordering; sparse matrix solution; sparse matrix solver; sparse storage schemes; transistor-level expansion; transputer array; Benchmark testing; Circuit simulation; Circuit synthesis; Circuit testing; Concurrent computing; Parallel algorithms; Partitioning algorithms; SPICE; Sparse matrices; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing, 1996. Proceedings. 3rd International Conference on
Conference_Location
Trivandrum
Print_ISBN
0-8186-7557-8
Type
conf
DOI
10.1109/HIPC.1996.565791
Filename
565791
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