DocumentCode :
3436677
Title :
Comparison of wall attachment and jet deflection microfluidic amplifiers
Author :
Furlan, Rogério ; Zemel, J.N.
Author_Institution :
Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
fYear :
1996
fDate :
11-15 Feb 1996
Firstpage :
372
Lastpage :
377
Abstract :
Two types of microfluidic amplifiers (unvented wall attachment and jet deflection) were examined using dry nitrogen as the test fluid. The devices were fabricated in silicon using standard micromachining methods and anodic sealing with a glass cap. Flow control and flow gain were demonstrated with supply pressures ranging up to 630 kPa. An asymmetric output flow was observed from the two output ports at sufficiently high supply pressures in both devices, suggesting possible shock wave formation. The jet deflection microfluidic amplifier presents a more symmetric behavior and provides higher flow variation than the wall attachment device. The ratio of the maximum and minimum output flows, as measured for the jet deflection device for various control and supply pressures, reveals a performance degradation at the onset of choked supply flow
Keywords :
flow control; fluidic devices; jets; microactuators; micromachining; nozzles; 630 kPa; N; anodic sealing; asymmetric output flow; choked supply flow; dry N2 test fluid; flow control; flow gain; glass cap; jet deflection; microfluidic amplifiers; micromachining; nozzle areas ratioing; performance degradation; shock wave formation; supply pressure dependence; symmetric behavior; unvented wall attachment; Fluid flow control; Fluid flow measurement; Glass; Microfluidics; Micromachining; Nitrogen; Pressure control; Shock waves; Silicon; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-2985-6
Type :
conf
DOI :
10.1109/MEMSYS.1996.494010
Filename :
494010
Link To Document :
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