DocumentCode :
34369
Title :
Ku-band 200-W Pulsed Power Amplifier Based on Waveguide Spatially Power-Combining Technique for Industrial Applications
Author :
Kaijun Song ; Fan Zhang ; Shunyong Hu ; Yong Fan
Author_Institution :
Extremely High Freq. (EHF) Key Lab. of Sci., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume :
61
Issue :
8
fYear :
2014
fDate :
Aug. 2014
Firstpage :
4274
Lastpage :
4280
Abstract :
A Ku-band 200-W pulsed solid-state power amplifier has been presented and designed by using a hybrid radial-/rectangular-waveguide spatially power-combining technique. The hybrid radial-/rectangular-waveguide power-dividing/power-combining circuit employed in this design provides not only a high power-combining efficiency over a wide bandwidth but also efficient heat sinking for the active power devices. A simple design approach of the presented power-dividing/power-combining structure has been developed. The measured small-signal gain of the pulsed power amplifier is about 51.3 dB over the operating frequency range, while the measured maximum output power at 1-dB compression is 209 W at 13.9 GHz, with an active power-combining efficiency of about 91%. Furthermore, the active power-combining efficiency is greater than 82% from 13.75 to 14.5 GHz.
Keywords :
microwave power amplifiers; power combiners; power dividers; rectangular waveguides; Ku band pulsed power amplifier; frequency 13.75 GHz to 14.5 GHz; gain 51.3 dB; hybrid radial-rectangular waveguide; industrial applications; power 200 W; power 209 W; power dividing circuit; solid state power amplifier; waveguide spatially power combining technique; Frequency measurement; Hybrid power systems; Power amplifiers; Power dividers; Power measurement; Probes; Rectangular waveguides; Hybrid radial/rectangular waveguide; Ku-band; power divider/combiner; pulsed solid-state power amplifier; spatially power-combining technique;
fLanguage :
English
Journal_Title :
Industrial Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0046
Type :
jour
DOI :
10.1109/TIE.2013.2284137
Filename :
6616589
Link To Document :
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