Sensitivity analysis of PCB´s design parameters of the plated through hole

As the demand grows for multiple functionality and high density, the reliability of plated through hole (PTH) becomes a concern because of the difficulty in small window plating. Choosing a favorable stress-strain model is an important part of PTH´s reliability assessment. In this paper, the stress-strain model of Mirman and enhanced IPC (Association Connecting Electronics Industries) are considered to analyze the sensitivity of geometric parameters, the finite element analysis (FEA) data is used to verify the above results. In conclusion, the enhanced IPC model is more suitable for analyzing the influence of geometric parameters on PTH than Mirman model. And most of analysis results calculated by the enhanced IPC model are consistent with FEA´s results. The analysis results also provide a reference for the selection of geometric parameters.