Title :
Dynamic reliability characteristics of ultra-thin HfO2
Author :
Kim, Y.H. ; Onishi, K. ; Kang, C.S. ; Choi, R. ; Cho, H.-J. ; Krishnan, S. ; Shahriar, A. ; Lee, J.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fDate :
30 March-4 April 2003
Abstract :
In this work, we present time-to-breakdown characteristics of HfO2 under unipolar AC voltage stress on MOS capacitors. It is shown that HfO2 displays a longer lifetime under AC stress than constant voltage stress. Higher frequency and lower duty cycle in the AC stress resulted in a longer lifetime enhancement. As the thickness decreases, the amount of lifetime enhancement decreases. The enhancement of unipolar tBD is attributed to less charge trapping during the "on time", ton and charge detrapping during the off time, toff. It is proposed that the characteristic time (τin) for charge to be trapped in HfO2 is longer than ton of unipolar stress. Also, we found a strong correlation between ton and toff with regard to how it leads to lifetime enhancement.
Keywords :
MOS capacitors; MOSFET; dielectric thin films; hafnium compounds; semiconductor device breakdown; semiconductor device reliability; HfO2 MOSFETs; HfO2-Si; MOS capacitor; characteristic time; charge detrapping; charge trapping; duty cycle; dynamic reliability characteristics; frequency dependence; gate oxide breakdown; lifetime enhancement; time-to-breakdown characteristics; ultra-thin HfO2; unipolar AC voltage stress; Electric breakdown; Frequency; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; Sputtering; Stress; Temperature; Voltage;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197719