Author_Institution :
Silicon Eng., Austin, TX, USA
fDate :
30 March-4 April 2003
Abstract :
Latchup is a failure mode in CMOS circuits that results in either soft failures with a loss of data or logic state, or in extreme cases, a destructive hard failure and permanent loss of the circuit. As isolation widths shrink, device structures become ever more susceptible to both failure modes, unless steps are taken to improve latchup robustness. The rapid proliferation of multiple power supply voltages and system-on-chip designs also exacerbate the problem. Prevention of both transient and destructive failures is of utmost importance in advanced CMOS designs. CMOS technologies have largely converged on p-bulk substrates. Reducing the CMOS power supply voltage is a potential solution for hard latchup failures, but not soft ones. This paper presents characterizations of latchup obtained by process and device modeling. Introducing a low resistance shunt layer by ion implantation is shown to be the most effective method for preventing all types of latchup failures.
Keywords :
CMOS integrated circuits; buried layers; failure analysis; integrated circuit reliability; ion implantation; isolation technology; low-power electronics; system-on-chip; CMOS circuits; buried guard ring; data loss; destructive hard failure; device modeling; failure mode; guard ring; high dose buried layer; ion implantation; isolation widths; latchup; logic state loss; low resistance shunt layer; multiple power supply voltages; power supply voltage reduction; process modeling; soft failures; system-on-chip designs; transient failures; CMOS logic circuits; CMOS technology; MOSFET circuits; Manufacturing; Power supplies; Power system transients; Semiconductor device modeling; Silicon; Substrates; Voltage;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197724