Title : 
New observance and analysis of various guard-ring structures on latch-up hardness by backside photo emission image
         
        
            Author : 
Liao, Scott ; Niou, Chomg ; Chien, Kary ; Guo, Annie ; Dong, Walden ; Huang, Charles
         
        
            Author_Institution : 
Reliability Eng., Semicond. Manuf. Int. Co., Shanghai, China
         
        
        
            fDate : 
30 March-4 April 2003
         
        
        
        
            Abstract : 
In this paper, the influence of different guard-ring structures on latch-up susceptibility has been studied on four standard test structures fabricated on a standard twin well CMOS process. The test structures include the non-, single, double, and multi-double guard-rings. Based on hold I-V characteristics test results, the latch-up hardness of the P+ guard-ring structure is much greater than that of the N+ guard-ring. Because the shunting resistances of N-well and P-well are significantly reduced by multi-double guard-rings, the latchup immunities of multi-double guard-ring structures are better than those of double guard-ring structures.
         
        
            Keywords : 
CMOS integrated circuits; avalanche breakdown; current distribution; integrated circuit reliability; integrated circuit testing; photoelectron microscopy; 0.18 micron; N+ guard-ring structure; P+ guard-ring structure; backside photo emission image; double guard-ring structure; guard-ring structures; hold I-V characteristics; latch-up hardness; latch-up immunities; latch-up susceptibility; multi-double guard-ring structure; multi-double guard-rings; shunting resistances; single guard-ring structure; standard test structures; twin well CMOS process; Circuit testing; Conductivity; Current distribution; Image analysis; Microscopy; Power supplies; Resistors; Thyristors; Transmission lines; Voltage;
         
        
        
        
            Conference_Titel : 
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
         
        
            Print_ISBN : 
0-7803-7649-8
         
        
        
            DOI : 
10.1109/RELPHY.2003.1197726