DocumentCode :
3437381
Title :
Multi-chip packaging for high performance systems
Author :
Chao, Clinton C. ; Chen, Kim H. ; Kaw, Ravi ; Leibovitz, Jacques ; Nagesh, V.K. ; Scholz, Kenneth D.
Author_Institution :
Hewlett Packard Co., Palo Alto, CA, USA
fYear :
1988
fDate :
3-5 Oct 1988
Firstpage :
76
Lastpage :
81
Abstract :
Multichip module (MCM) substrate, component assembly, and cooling technologies have been developed and demonstrated on several vehicles that include a 4-Kbyte RAM module operating at above 100-MHz clock frequency. An optimum MCM may consist of a set of composite layers of a multi-layer thin film polyimide structure over a multilayer ceramic substrate with a high pin density. The MCM technology provides system designers with increased circuit packing density and a larger number of accessible circuits, which results in lower machine-cycle time and cycles per instruction, leading to higher system performance. Moreover, the MCM technology opens up options for circuit organization and system architecture and for further improvements in system performance
Keywords :
integrated memory circuits; modules; monolithic integrated circuits; packaging; random-access storage; 100 MHz; 100-MHz clock frequency; 4 KB; 4-Kbyte RAM module; circuit packing density; component assembly; composite layers; cooling technologies; cycles per instruction; high performance systems; high pin density; machine-cycle time; multi-chip module; multi-layer thin film polyimide structure; multichip packaging; multilayer ceramic substrate; Assembly; Circuits; Clocks; Cooling; Frequency; Multichip modules; Packaging; Substrates; System performance; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
Conference_Location :
Rye Brook, NY
Print_ISBN :
0-8186-0872-2
Type :
conf
DOI :
10.1109/ICCD.1988.25663
Filename :
25663
Link To Document :
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