DocumentCode
3437391
Title
Modeling and simulation of coupled lossy lines for VLSI interconnections
Author
Palusinski, O.A. ; Cangellaris, A.C. ; Prince, J.L. ; Liao, J.C. ; Vakanis, L.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
1988
fDate
3-5 Oct 1988
Firstpage
82
Lastpage
86
Abstract
The authors present techniques for the analysis of signal propagation in the interconnections used in VLSI systems. The propagation is modelled by coupled transmission lines which include losses. For conductors whose thickness is small compared to the skin depth over the principal spectrum of the pulse being propagated, the losses can be treated as frequency-independent; otherwise, the losses must be calculated as a function of frequency. It was observed that the inductance may be approximately treated as constant, but the resistance variations in frequency may be significant. A semi-analytical method for computing the transients in lossy lines serves as the basis for the simulation of nonuniform lines
Keywords
VLSI; circuit analysis computing; digital integrated circuits; transmission line theory; transmission lines; VHSIC; VLSI interconnections; coupled lossy lines; coupled transmission lines; frequency-independent; nonuniform lines; signal propagation; simulation; skin depth; transients; Conductors; Couplings; Frequency; Inductance; Power system transients; Propagation losses; Signal analysis; Skin; Transmission lines; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
Conference_Location
Rye Brook, NY
Print_ISBN
0-8186-0872-2
Type
conf
DOI
10.1109/ICCD.1988.25664
Filename
25664
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