DocumentCode
3437444
Title
A 32 × 32 channels, 3-cm2, 555-mW chip for X-ray pixel detector read-out
Author
Grassi, M. ; Ferragina, V. ; Malcovati, P. ; Caccia, Stefano ; Bertuccio, G. ; Martin, Daniel ; Bastia, P. ; Cappelluti, I. ; Ratti, N.
Author_Institution
Dept. of Electr. Eng., Univ. of Pavia, Pavia, Italy
fYear
2009
fDate
13-16 Dec. 2009
Firstpage
227
Lastpage
230
Abstract
In this paper we present a spectrometer realized by bump-bonding a 300-¿m-pitch, 32 × 32 pixel silicon X-ray detector chip to a 0.35-¿m CMOS, 3-cm2 read-out chip. The self-triggered, mixed analog-digital read-out chip, with 1024 channels, digitizes the X-ray photon energy with 10 bits of resolution, provides the coordinates of the triggered pixels and achieves 34 erms - of input referred noise, ±3.3 LSB of INL and ±0.2 LSB of DNL, while consuming 555 mW from a 3.3 V supply. Preliminary experimental results on the complete spectrometer, obtained both with electrical stimulation of the device and by irradiating the detector with X-rays, are reported.
Keywords
CMOS integrated circuits; X-ray detection; X-ray spectrometers; mixed analogue-digital integrated circuits; nuclear electronics; readout electronics; silicon radiation detectors; 32 Ã\x97 32 pixel silicon X-ray detector chip; CMOS readout chip; X-ray photon energy; bump bonding; electrical stimulation; input referred noise; power 555 mW; self-triggered mixed analog-digital readout chip; size 0.35 mum; spectrometer; voltage 3.3 V; Analog-digital conversion; Crosstalk; Logic arrays; Logic circuits; Logic devices; Preamplifiers; Silicon; Spectroscopy; X-ray detection; X-ray detectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
Conference_Location
Yasmine Hammamet
Print_ISBN
978-1-4244-5090-9
Electronic_ISBN
978-1-4244-5091-6
Type
conf
DOI
10.1109/ICECS.2009.5410981
Filename
5410981
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