Title :
Collapse of MOSFET drain current after soft breakdown and its dependence on the transistor aspect ratio W/L
Author :
Cester, A. ; Cimino, S. ; Paccagnella, A. ; Ghidini, G. ; Guegan, G.
Author_Institution :
Dipt. di Ingegneria dell´´Informazione, Padova Univ., Italy
fDate :
30 March-4 April 2003
Abstract :
Gate oxide soft breakdown (SB) can have a severe impact on MOSFET performance even when not producing any large increase of the gate leakage current. The soft breakdown effect on the MOSFET characteristics strongly depends on the aspect ratio W/L: drain saturation current and MOSFET transconductance dramatically drop in transistors with small W/L after soft breakdown. As W/L increases, the SB effect on the drain current fades. The drain saturation current and transconductance collapse are due to the formation of an oxide defective region around the SB spot, the area of which is much larger than the SB conductive path. Similar degradation can be observed even in heavy ion irradiated MOSFETs where localized damaged oxide regions are generated by the impinging ions without producing, any increase of gate leakage current.
Keywords :
MOSFET; ion beam effects; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; MOSFET; degradation; drain current collapse; drain saturation current; gate leakage current; gate oxide soft breakdown; heavy ion irradiated MOSFETs; localized damaged oxide regions; oxide defective region; oxide reliability; transconductance collapse; transistor aspect ratio; Circuit noise; Degradation; Electric breakdown; Electric variables; Energy consumption; Leakage current; MOSFET circuits; Microelectronics; Transconductance; Voltage;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197744