DocumentCode :
3437811
Title :
A study of plastic encapsulated microcircuits (PEMs) in JPL space hardware
Author :
Sandor, Mike ; Cuddihy, Ed ; Agarwal, Shri
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
1998
fDate :
27-29 May 1998
Firstpage :
405
Lastpage :
421
Abstract :
The qualification and use of COTS parts including parts assembled with plastic packages are currently under study and evaluation by the Jet Propulsion Laboratory. Work is underway to build a database for PEMs that will aide in determining acceptance of generic part families by vendor and package. Data is being gathered on PEMs which includes radiation tolerance, outgassing, moisture absorption/desorption, acoustic microscopy, glass transition temperature, and dye penetration. The results will then be used to make quality, reliability, and risk assessments that in turn would provide projects an avenue to use COTS parts for various missions. The end objective is to establish and define criteria that will allow users of PEMs to determine their risk when plastic parts are used in lieu of traditional ceramic parts. The data and findings will be presented
Keywords :
acoustic microscopy; glass transition; integrated circuit packaging; integrated circuit reliability; outgassing; plastic packaging; quality management; radiation hardening (electronics); risk management; sorption; space vehicle electronics; COTS parts; Mars Pathfinder; acoustic microscopy; dye penetration; generic part families; glass transition temperature; moisture absorption/desorption; outgassing; plastic encapsulated microcircuits; plastic packages; qualification; quality assessment; radiation tolerance; reliability; risk assessment; space hardware; vendor acceptance; weight gain; Absorption; Assembly; Databases; Group technology; Laboratories; Microscopy; Moisture; Plastic packaging; Propulsion; Qualifications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium, 1998. Proceedings of the 1998 IEEE International
Conference_Location :
Pasadena, CA
ISSN :
1075-6787
Print_ISBN :
0-7803-4373-5
Type :
conf
DOI :
10.1109/FREQ.1998.717934
Filename :
717934
Link To Document :
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