DocumentCode :
3437880
Title :
Design and characterization of magnetically coupled on-chip current probe for monitoring switching current in chip I/O PDN
Author :
Changhyun Cho ; Kim, Jonghoon J. ; Joungho Kim ; Jun So Pak
Author_Institution :
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
fYear :
2012
fDate :
9-11 Dec. 2012
Firstpage :
243
Lastpage :
246
Abstract :
In this paper, we present an on-chip embedded current probe that uses magnetic field coupling mechanism to determine on-chip switching current waveform especially in chip I/O power distribution network (PDN). We first investigate the characteristics of magnetic coupling behaviour of proposed on-chip current probing structure in various geometrical design parameters like metal width and ratio of winding turns. And then we explain our current waveform reconstruction technique which is based on time and frequency domain measurement data of our proposed on-chip current probe including magnetically induced voltage measured in time domain and transfer impedance measured in frequency domain. Numerical simulation results and experimental measurement results are shown to demonstrate the magnetic coupling behaviour of our on-chip embedded current probes which are designed using a Samsung 0.13um CMOS process.
Keywords :
CMOS integrated circuits; electromagnetic coupling; frequency-domain analysis; magnetic circuits; magnetic fields; numerical analysis; time-domain analysis; Samsung CMOS process; chip I/O PDN; chip I/O power distribution network; current waveform reconstruction technique; frequency-domain analysis; geometrical design parameters; magnetic coupling behaviour characteristics; magnetic field coupling mechanism; magnetically coupled on-chip current probe design; magnetically induced voltage; metal width; numerical simulation; on-chip current probing structure; on-chip switching current waveform; size 0.13 mum; time domain analysis; transfer impedance; winding turn ratio; Coils; Current measurement; Frequency measurement; Impedance; Probes; System-on-a-chip; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
Type :
conf
DOI :
10.1109/EDAPS.2012.6469422
Filename :
6469422
Link To Document :
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